Soldering Process
Wave soldering makes use of a container to hold a certain amount of the molten solder. The components to be soldered is introduced into or placed on the PCB. The PCB with the components is driven across a pumped wave or flow of solder. The solder in turn moistens the metallic parts of the board that are uncovered, thereby creating an accurate electrical and mechanical connection.
Specifications of Wave Soldering Machine
Following parameters needs to be considered while using the machine :
- Preheating : It is the temperature of the PCB on component side just before soldering temperature touches 85oC.
- Wetting time : It is the interval between the moment of first contact between the parts to be soldered and the solder; and the moment when the solder in the joints starts hardening.
- Dwell time : It can be defined as the time between the moment of first contact between the parts to be soldered and the solder; and also the moment of last contact with the solder.
- Soldering time : The time period when the PCB actually contacts the solder and solidification of solder starts.
- Solidification time : The time during which the solder gets solid on the bottom of the PCB.
- Cooling time : It is the time required to produce forced cooling after soldering reduces the maximum temperature reached on the component side of the board.
Some of the areas where the Wave soldering machine is used include :
- Soldering through-hole printed circuit
- Soldering surface mount circuits
- Soldering electronic components
- Telecom applications




